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‚Q‚O‚Q‚T”N‚P‚QŒŽ‚Q‚V“úXV

 
ƒEƒGƒn
Company Location Products Remarks
S (Š”)SUMCO “ú–{ ƒEƒGƒn IR
  @SUMCO TECHXIV(Š”) “ú–{ ƒEƒGƒn IR
‚³ ƒZ[ƒŒƒ“KST(Š”) “ú–{ »•iƒT[ƒrƒX
M‰z‰»ŠwH‹Æ(Š”) “ú–{ ƒEƒGƒn IR
@M‰z”¼“±‘Ì(Š”)/”’‰ÍHê “ú–{ ƒEƒGƒn IR
  @’¼]’ÓdŽqH‹Æ(Š”) “ú–{ ƒEƒGƒn
  @’·–ì“dŽqH‹Æ(Š”) “ú–{ ƒEƒGƒn
  @ŽO‰v”¼“±‘ÌH‹Æ(Š”) “ú–{ ƒEƒGƒn
Z—F‰»Šw(Š”)/‰»‡•¨”¼“±‘ÌÞ—¿E”––ŒÞ—¿ “ú–{ SCIOCS
‚Ü (Š”)¼è»ìŠNew “ú–{ ƒEƒGƒn  
‚í (Š”)ƒƒJƒeƒbƒN “ú–{ ƒEƒGƒn  
Company Location Products Remarks
G GlobalWafers Co., Ltd. ‘ä˜p Product IR
  GlobalWafers Co., Ltd. ‘ä˜p Product
  @ƒOƒ[ƒoƒ‹ƒEƒF[ƒnƒYEƒWƒƒƒpƒ“(Š”) “ú–{ Product IR
  @@ƒGƒ€EƒC[EƒGƒ€EƒV[(Š”) “ú–{ Product
E Episil-precision inc. ‘ä˜p EPI IR
SICC Co., Ltd. ’†‘ SiC
  @SICC GLOBAL(Š”)      
S Siltronic AG ƒhƒCƒc Product IR
SK siltron Co.,Ltd. ŠØ‘ Product IR
  @SK Gloup ŠØ‘    
  Soitec SA ƒtƒ‰ƒ“ƒX Product IR
  @ƒ\ƒCƒeƒbƒN      
W Wafer Works Corp. ‘ä˜p Product IR
@ƒEƒF[ƒnƒ[ƒNƒX
  ƒtƒHƒgƒŒƒWƒXƒg      
  Company Location Products IR
J JSR(Š”) ‹’“_ˆê—— ”¼“±‘ÌÞ—¿  
‚³ M‰z‰»ŠwH‹Æ(Š”) ‹’“_ˆê—— ƒtƒHƒgƒŒƒWƒXƒg  
  Z—F‰»Šw(Š”) ‹’“_ˆê—— ƒtƒHƒgƒŒƒWƒXƒg  
‚½ “Œ‹ž‰ž‰»H‹Æ(Š”) ‹’“_ˆê—— ƒtƒHƒgƒŒƒWƒXƒg  
‚È ƒiƒKƒZƒPƒ€ƒeƒbƒNƒX(Š”) ‹’“_ˆê—— ƒtƒHƒgƒŒƒWƒXƒg  
  “úŽY‰»ŠwH‹Æ(Š”) ‹’“_ˆê—— ARC  
  “ú–{ƒ[ƒIƒ“(Š”) ‹’“_ˆê—— ƒtƒHƒgƒŒƒWƒXƒg  
‚Í •xŽmƒtƒCƒ‹ƒ€ƒGƒŒƒNƒgƒƒjƒNƒXƒ}ƒeƒŠƒAƒ‹ƒY(Š”) ‹’“_ˆê—— ƒtƒHƒgƒŒƒWƒXƒg  
  Company Location Products IR
C Cornerstone Technologies Company ’†‘ Products
D DisChem, Inc. •Ä‘ Products  
I Integrated Micro Materials •Ä‘ Products  
P Prolyx Microelectronics Pvt. Ltd. ƒCƒ“ƒh Products  
D Dongjin Semichem Co., Ltd. ŠØ‘ Photoresist  
A Allresist GmbH ƒhƒCƒc Products  
M Microchemicals GmbH ƒhƒCƒc Products  
R Rongda/—e‘労Œõ/
ShenZhen Rongda Photosensitive Science & Technology Co., Ltd.
’†‘ Products  
  ƒtƒHƒgƒŒƒWƒXƒgÞ      
  Company Location Products IR
A (Š”)ADEKA ‹’“_ˆê—— “Y‰ÁÜ  
‚  ‘åã—L‹@‰»ŠwH‹Æ(Š”) ‹’“_ˆê—— ”¼“±‘ÌÞ—¿  
‚½ “c‰ª‰»ŠwH‹Æ(Š”) ‹’“_ˆê—— ƒŒƒWƒXƒgŒ´—¿  
“Œ—m‡¬H‹Æ(Š”) ‹’“_ˆê—— Þ—¿  
  ƒ_ƒCƒh[ƒPƒ~ƒbƒNƒX(Š”) ‹’“_ˆê—— “dŽqÞ—¿  
CMPƒXƒ‰ƒŠ[  
Company Location Products  
A AGC(Š”) ‹’“_ˆê—— CMPƒXƒ‰ƒŠ[  
J JSR(Š”) ‹’“_ˆê—— CMPƒXƒ‰ƒŠ[  
‚È ƒjƒbƒ^Eƒfƒ…ƒ|ƒ“(Š”) ‹’“_ˆê—— CMPƒXƒ‰ƒŠ[  
“ú–{ƒCƒ“ƒeƒOƒŠƒX(‡) ‹’“_ˆê—— “dŽqÞ—¿  
  @Entegris, Inc. ƒAƒƒŠƒJ    
‚Í •xŽmƒtƒCƒ‹ƒ€(Š”) ‹’“_ˆê—— CMPƒXƒ‰ƒŠ[  
  (Š”)ƒtƒWƒ~ƒCƒ“ƒR[ƒ|ƒŒ[ƒeƒbƒh ‹’“_ˆê—— CMPƒXƒ‰ƒŠ[  
  (Š”)ƒŒƒ]ƒiƒbƒN ‹’“_ˆê—— CMPƒXƒ‰ƒŠ[  
  Company Location Products IR
D DuPont •Ä‘ CMP slurries  
  “ÁŽêƒKƒX      
  Company Location Products  
  ŠÖ“Œ“d‰»H‹Æ(Š”) ‹’“_ˆê—— “ÁŽêƒKƒX IR
  (Š”)ƒŒƒ]ƒiƒbƒN ‹’“_ˆê—— ”¼“±‘Ì IR
F Foosung Co Ltd. ŠØ‘ Gas  
  SK specialty ŠØ‘   IR
  SK specialty Japan(Š”) ‹’“_ “ÁŽêƒKƒX  
M Merck ƒhƒCƒc ”¼“±‘Ì  
  “dŽqÞ—¿      
  Company Location Products IR
A artience(Š”) ‹’“_ˆê—— “dŽqÞ—¿
K KHƒlƒIƒPƒ€(Š”) ‹’“_ˆê—— “dŽqÞ—¿
‚© ŠÖ“Œ‰»Šw(Š”) ‹’“_ˆê—— “dŽqÞ—¿  
‚³ Z—F‰»Šw(Š”) ‹’“_ˆê—— “dŽqÞ—¿
‚½ “c’†‹M‹à‘®ƒOƒ‹[ƒv ‹’“_ˆê—— »•iî•ñ  
  “Œ–M‰»ŠwH‹Æ(Š”) ‹’“_ˆê—— »•iî•ñ IR
@ (Š”)ƒgƒNƒ„ƒ} ‹’“_ˆê—— “dŽqÞ—¿  
  (Š”)ƒgƒŠƒPƒ~ƒJƒ‹Œ¤‹†Š ‹’“_ˆê—— »•iî•ñ IR
‚È ƒiƒ~ƒbƒNƒX(Š”) ‹’“_ˆê—— »•iî•ñ
“ú“SƒPƒ~ƒJƒ‹•ƒ}ƒeƒŠƒAƒ‹(Š”) ‹’“_ˆê—— »•iî•ñ  
“ú“Sƒ}ƒCƒNƒƒƒ^ƒ‹(Š”) ‹’“_ˆê—— »•iî•ñ
‚Í ƒnƒŠƒ}‰»¬ƒOƒ‹[ƒv(Š”) ‹’“_ˆê—— “dŽqÞ—¿  
‚Ü ƒƒbƒN(Š”) ‹’“_ˆê—— “dŽqŠî”Â
ƒƒ‹ƒeƒbƒNƒX(Š”) ‹’“_ˆê—— »•iî•ñ
  Company Location Products IR
D DuPont •Ä‘ Products  
E ENF Technology Co., Ltd. ŠØ‘ Products  
M MTI ECO INNO. ŠØ‘ Products  
2022/6/19/§’è