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SEMICON Taiwan to be Held as Scheduled, September 15-17 |
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| TAIPEI, Taiwan, June 25, 2003 -- SEMI- today announced its plans to hold
the SEMICON Taiwan 2003 exposition as scheduled, September 15-17, 2003, at the Taipei World Trade Center in Taipei, Taiwan. SEMICON Taiwan is organized by SEMI, co-sponsored by the China External Trade Development Council (CETRA), and endorsed by the Taiwan Semiconductor Industry Association (TSIA). SEMICON Taiwan is the largest exposition dedicated to microelectronics manufacturing in Taiwan. To date, more than 330 companies occupying more than 9,800 square meters of exhibit space are scheduled to take part in this year's event. Last year, SEMICON Taiwan attracted more than 22,000 visitors. "Taiwan is a critical market for microelectronics manufacturing and as the global industry looks to recover from three years of downturn, we believe SEMICON Taiwan presents a great opportunity for industry to get back to business," said George Lin, president of SEMI Southeast Asia. In 2002, Taiwan was one of the few highlights for the global semiconducto industry. Spending on capital equipment grew modestly--nine percent--to $3.5 billion, making Taiwan the world's third largest market for semiconductor equipment. In comparison, worldwide spending on capital equipment declined 30 percent last year to $19.7 billion. Online visitor registration will be available beginning in mid-July. For more information regarding SEMICON Taiwan 2003, visit www.semi.org/semicontaiwan. SEMI is a global industry association serving more than 2,500 companies that develop and provide manufacturing technology and materials to the global semiconductor, flat panel display, MEMS and related microelectronics industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org. |
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SEMI FORUM JAPAN 2003 本日開幕 （グランキューブ大阪にて、26日（木）まで開催） 基調講演会に 松下電器 古池 進 氏 登壇 「半導体は、Integrated Solution Company (ISC) の時代」 |
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| 本日6月24日（火）、SEMI（Semiconductor Equipment and Materials
International）主催の「SEMI FORUM JAPAN 2003」が、大阪市のグランキューブ大阪（大阪国際会議場）にて開幕いたしました。 SEMI FORUM JAPAN は、システム、デバイス、装置、材料など半導体バリューシステムを包括するセミナー主体のイベント で、今年で第3回目を迎えました。2002年6月に開催された第2回 SEMI FORUM JAPANには、27のプログラムおよび 37のスタンタード関連会議に業界関係者のべ2,326名が参加しました。 本年も“IT System & ULSI Technology”をテーマに、6月24日（火）〜26日（木）の3日間で26プログラムおよび スタンダード関連会議が開かれます。日本半導体ベンチャー協会（JASVA）、SSIS半導体シニア協会、応用物理学会、 関西半導体解析技術研究会、半導体業界ソフトウェア供給会社交流会（VANS）よりも協賛・協力を受け、これら各団体 主催のプログラムも開催されます。本年は、3日間でのべ約2,500名の参加が見込まれています。 今回のSEMI FORUM JAPAN では、ビジネスとしても拡大が期待されるSoC (System on Chip)／システムLSI分野に 焦点をあて、日本の半導体事業戦略のあるべき姿を考えていきます。 本日9時50分より開催された「SEMI/JASVA基調講演会」では、松下電器産業株式会社 代表取締役常務半導体社社長 古池 進 氏が「ディジタルコンシューマー時代のシステムLSI戦略」と題して、講演を行いました。古池氏は同講演において、 「セットの市場を確保するものが半導体のメインプレーヤーとなり、21世紀にはネットでつながるディジタルコンシューマー 機器が大きな市場を獲得する可能性がある。即ち、システムLSIの時代が来ている、と言えよう。」、「21世紀の半導体 ソリューションビジネスこそが“システムLSI”であり、松下のシステムLSI事業は、ディジタルコンシューマーに事業領域を 集中して、知恵の差別化と時間軸競争を重視し、デファクト形成による多面的回収-Integrated Solution-により事業を成立 させる戦略をとる。」と述べました｡ また、松下におけるシステムＬＳＩの例として、「世界初のディジタルTV用1チップバック エンドLSI」や「DVDプレーヤ用1チップLSI」をあげて紹介されました。 さらに、システムLSIの生産については、「ファブレス、ファウンダリとＩＤＭ (Integrated Device Manufacturer) の関係に ついては、微細化の進行により設計とプロセスのマージンが小さくなるため、これまでのようなファブレス＋ファウンダリによる 生産は難しくなる。」との見通しを述べました。最後に、「Integrated Solution Company (ISC) は美しいビジネスモデルで あるが、現実には幾多の困難が横たわっており､半導体装置・材料業界とデバイスメーカーが一体となった技術革新こそが、 半導体産業成長の源泉である。」とまとめました。 SEMI/JASVA基調講演会では、株式会社先端SoC基盤技術開発(ASPLA) 代表取締役社長兼CEO 川手 啓一 氏も 「AS☆PLA プラットフォーム −ファブレスベンチャーとIDMの協業環境として−」と題して講演を行いました。 また、本日午後は、「SEMI FORUM JAPAN エグゼクティブシンポジウム」パネル討論に、パネリストとして、ドイツ証券 東京支店株式調査部･マネージングディレクター／株式調査部長 佐藤 文昭 氏、株式会社リコー 電子デバイスカンパニー デピュティプレジデント 中山 春夫 氏、エルピーダメモリ株式会社 代表取締役社長兼CEO 坂本 幸雄 氏、株式会社 ルネサステクノロジ 代表取締役 取締役社長&COO 伊藤 達 氏、経済産業省 商務情報政策局情報通信機器課 課長 福田 秀敬 氏が参加され、“事業再編を踏まえた日本半導体ビジネスの行方”をテーマに議論を展開する予定です。 SEMI FORUM JAPAN 2003では、明日25日（水）および翌26日（木）も、「第5回マイクロマシンセミナー」をはじめとする 技術セミナー、「IC Tutorialセミナー」、「SEMIマーケットセミナー」、スタンダード関連会議など、多彩なプログラムが予定 されています。 SEMI FORUM JAPAN 2003 各プログラムの詳細は、Webサイトでご案内しています。 ・URL：http://www.semi.org/sfj2003 また、SEMI FORUM JAPAN 2003に関するお問い合わせは、SEMIジャパン マーケティング部（Tel: 03-3222-5993、 E-Mail: jeventinfo@semi.org）でお受けしています。 SEMI FORUM JAPAN 2003 の各プログラムは、席に余裕のある限り、会場での当日受付も承っています。皆様のご参加を お待ちしております。 「SEMI FORUM JAPAN 2003」 開催概要 ●会期：2003年6月24日(火)〜26日(木) 3日間 ●会場：グランキューブ大阪（大阪国際会議場） ●主催：SEMI (Semiconductor Equipment and Materials International) ●協賛：日本半導体ベンチャー協会(JASVA)、SSIS半導体シニア協会 ●聴講：有料 ※一部無料講演あり ●WEBサイト：http://www.semi.org/sfj2003 ●プログラム概要：
････････････････････････････････････････････････････････････････････ SEMI（Semiconductor Equipment and Materials International） SEMIは、半導体およびフラットパネルディスプレイ（FPD）関連製造装置・材料産業の国際的な工業会組織として、業界の 健全な発展と国際協調を願って多岐にわたる活動を行っています。現在、オースティン、サンノゼ、上海、シンガポール、 新竹、ソウル、東京、ブリュッセル、北京、モスクワ、ワシントンDCにオフィスがあり、会員企業は約2,500社、この内日本 企業は約580社にのぼります。 ・SEMI本部： 3081 Zanker Road, San Jose, CA 95134-2127, U.S.A. Tel:+1-408-943-6900, Fax:+1-408-428-9600, E-mail:semihq@semi.org, URL:www.semi.org ・SEMI日本事務所：SEMIジャパン 代表 内田 傳之助 〒102-0074 東京都千代田区九段南4-7-15 健和ビル7F Tel:03-3222-5755, Fax:03-3222-5757, E-mail:semijapan@semi.org, URL:www.semi.org/japan |
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MEMS Breaks Out at SEMICON West 2003 New Committee to Guide Global Efforts of MEMS Steering Group |
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| SAN JOSE, Calif., June 23, 2003 ‐ The world of micro-electromechanical
systems (MEMS) debuts at SEMICON West next month, with a dedicated MEMS pavilion and one-day MEMS conference featured as part of the week-long exposition activities. The first MEMS event at SEMICON West 2003 will be the MEMS Pavilion, open from July 14 to 16 in the Esplanade Hall of the Moscone Center, San Francisco. The pavilion will showcase the latest technologies and tools dedicated to MEMS. A one-day MEMS conference, with the theme “Microsystems: Lessons Learned From the Semiconductor Industry,” will be held July 16. Expert speakers will focus on topics such as the market opportunity for MEMS, packaging and system integration issues, metrology applications, and commercial MEMS production in a semiconductor-manufacturing environment. “Just as silicon has become pervasive, going forward we will see MEMS devices become part of our everyday life,” said Stanley T. Myers, president and CEO of SEMI. “Many companies in the semiconductor industry are finding that they can leverage their manufacturing and R&D skills and apply them to MEMS. SEMI is playing an important role in facilitating this trend.” The 33rd annual SEMICON West opens at the Moscone Center July 14-16, and continues at the San Jose Convention Center July 16-18. The exposition is presented by SEMI, the global industry association for semiconductor and related microelectronics manufacturing. The MEMS pavilion and conference are co-sponsored by the MEMS Industry Group and MANCEF, the Micro and Nanotechnology Commercialization Education Foundation. SEMI’s involvement in MEMS dates back to 1994 when it first conducted discussions with European organizations involved in the emerging MEMS industry. SEMI also provided funds for the development of the first MEMS industry roadmap, published in 2002 by MANCEF. Earlier this year, SEMI established the International MEMS Steering Group to co-ordinate the global MEMS activities of the association. More than 100 organizations from Europe, Asia Pacific and North America have so far joined the IMSG. In the most recent development, Joseph M. Brown, regional marketing director for Suss MicroTec’s MEMS business in the Americas, was elected the first chairman of the IMSG. The vice chairman of the IMSG executive committee is Uwe Behringer of UBC Microelectronics, Germany. Other members of the executive committee include Martin Walker, Oxford Instruments, UK; Prof. Masayoshi Esashi, Tohoku University, Japan; and Winthrop Baylies, BayTech Group, U.S. “We are pleased to have leaders of the caliber of Joe Brown, along with his vice chair and executive committee members, to oversee the activities of the IMSG,” said Bettina Weiss, IMSG staff officer and SEMI’s manager of program development. “Even under difficult economic conditions, MEMS continues to project double digit growth worldwide,” said Brown. “Our vision is for the IMSG to guide the industry and share our resources for the benefit of all.” Based in San Jose, Calif., SEMI is an international industry association serving more than 2,500 companies participating in the semiconductor, flat panel display and MEMS equipment and materials markets. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit SEMI on the Internet at www.semi.org. |
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North American Semiconductor Equipment Industry Posts May 2003 Book-to-Bill Ration of 0.89 |
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| SAN JOSE, Calif., June 17, 2003 -- North American-based manufacturers of semiconductor
equipment posted $751 million in orders in May 2003 (three-month average basis) and a book-to-bill ratio of 0.89, according to the May 2003 Express Report published today by Semiconductor Equipment and Materials International (SEMI). A book-to-bill of 0.89 means that $89 worth of new orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in May 2003 was $751 million. The bookings figure is one percent below the revised April 2003 level of $757 million and 32 percent below the $1.11 billion in orders posted in May 2002. The three-month average of worldwide billings in May 2003 was $840 million. The billings figure is even with the revised April 2003 level and 3.5 percent below the May 2002 billings level of $870 million. "The outlook for front-end equipment remains sluggish, suggesting a single-digit recovery this year, although some analysts remain hopeful for the possibility of 10-15 percent billings growth in 2003," said Stanley Myers, president and CEO of SEMI. "Conditions are more positive for the test, assembly and packaging segment, which continues to post modest gains and could experience a double-digit recovery this year." The SEMI book-to-bill is a ratio of three-month moving average bookings to three-month moving average billings for the North American semiconductor equipment industry. Billings and bookings figures are in millions of U.S. dollars. |
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The data contained in this release was compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. can assume no responsibility for the accuracy of the underlying data. The data are contained in a monthly Express Report published by SEMI that tracks billings and orders worldwide of North American-based manufacturers of equipment used to manufacture semiconductor devices, not billings and orders of the chips themselves. The April 2003 Express Report is scheduled for publication on July 18, 2003 (subject to change). Based in San Jose, Calif., SEMI is an international industry association serving more than 2,500 companies participating in the semiconductor and flat panel display equipment and materials markets. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit SEMI on the Internet at www.semi.org. |
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SEMICON West 2003 Features Fab Managers Forum on July 17 Full Day Seminar Hosted by SEMI, International SEMATECH and the SIA |
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| SAN JOSE, Calif., June 16, 2003 -- The inaugural SEMICON West Fab Managers
Forum -- featuring expert advice from leading device makers and equipment suppliers on strategies and techniques for enhancing manufacturing productivity -- will be held Thursday, July 17. The forum, which focuses on the theme “Current and Future Trends in Semiconductor Manufacturing” is organized by SEMI and co-hosted by International SEMATECH, and the Semiconductor Industry Association (SIA). The event is part of the week’s activities at SEMICON West, the largest exposition of semiconductor equipment, materials and services in North America, which opens July 14 in San Francisco, continuing July 16 in San Jose. “The Fab Managers Forum affords a unique opportunity to learn the latest trends and strategies for improving semiconductor factory productivity and effectiveness,” said Vicki Hadfield, president of SEMI North America. “Dialogue between chipmakers and suppliers is essential to ensure that all participants in the supply chain benefit from advances in manufacturing technology.” Representatives from leading IDMs including Intel and Advanced Micro Devices and equipment suppliers such as Applied Materials, Brook Automation, Canon and Tokyo Electron Ltd will share their knowledge on strategies and techniques to improve productivity in the wafer fab. The program is divided into four sessions. The first covers “Mega Trends in Semiconductor Manufacturing”; Session II focuses on “Strategies for Enhanced Manufacturing Productivity”; Session III will look at “Issues in Advanced Manufacturing”; and the final session is a panel discussion on the topic of “Strategies, Challenges and Successes in Factory Automation Integration.” Opening remarks for the forum will be given by Kamal Aggarwal, Executive Vice President, National Semiconductor Corp. He will be followed by keynote speaker, William Siegle, Senior Vice President and Chief Technologist, Advanced Micro Devices Inc. SEMI has hosted a similar Fab Managers Forum in Europe for the past several years, held in conjunction with SEMICON Europa. The success of the European program prompted the establishment of a similar event for SEMICON West. The full day forum will be held at National Semiconductor’s facility in Sunnyvale, California, starting 8.30 a.m. For more information about the Fab Managers Forum visit the SEMICON West 2003 website at www.semi.org/semiconwest, or call SEMI Customer Service at 1.408.943.6901. Qualified journalists wishing to attend the forum must pre-register for media accreditation. Contact Jennifer Blatt, SEMI Public Relations at 1.408.943.7988 (jblatt@semi.org). Based in San Jose, Calif., SEMI is an international industry association serving more than 2,500 companies participating in the semiconductor and flat panel display equipment and materials markets. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit SEMI on the Internet at www.semi.org. |
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「グローバルスタンダードへの挑戦」刊行のお知らせ −300mm半導体工場のための標準化の歴史− |
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| SEMI（Semiconductor Equipment and Materials International）は、先ごろ、「グローバルスタンダードへの挑戦 −300mm半導体 工場のための標準化の歴史−」を刊行いたしました。 本書は､300mmウェーハの製造を実現するために業界が採用した、標準化による国際分業戦略とその実践の過程を記録したもの です。本日6月11日（水）より、「SEMIジャパン ON DEMAND LIBRARY」(www.bookpark.ne.jp/semi/)上で販売を開始いたします。 半導体製造の300mmウェーハへの移行は､業界の生産性を向上させるための必須要素でしたが､これは非常に困難な仕事で した。半導体産業は、電子デバイスの高集積化､高速化､低コスト化を実現してきていますが､その中心的役割を担っているのは、 絶え間ない研究開発に支えられた微細化とウェーハの大口径化です。 過去にウェーハの大口径化をリードした企業は､その研究開発費のために必ず体力を消耗していました。半導体業界は、次世代 ウェーハ口径への移行に合意し､標準化を優先させることで､個々の企業にかかる負荷を分散するとともに､業界全体として 次世代ウェーハ口径への移行費用を削減する戦略を採りました。 これにより、世界中の半導体デバイスメーカー､製造装置メーカー､材料メーカー､関連団体を巻き込んだグローバルな標準化 活動が7年以上に渡って行われました。 本書には、この標準化活動に携わった諸団体の活動の経緯､戦略や方針､成果、および標準化の背景や経緯が記され､スタン ダードの理解にも役立つ内容となっています。 活動の過程では、言語・思考過程・習慣の違い､標準化プロセスと標準に対する考え方､特許制度､そして意思決定プロセスの 違いなどが大きな壁となりましたが､それらを乗り越えて相互理解に至るプロセスなしには､国際合意を基本とする標準化は成し 得ませんでした。 本書は､日本企業がグローバル社会で競争力を維持､発展させていく上でも参考にしていただける内容となっています。 「グローバルスタンダードへの挑戦 −300mm半導体工場のための標準化の歴史−」について ◎ 署名： グローバルスタンダードへの挑戦 −300mm半導体工場のための標準化の歴史− ◎ 監修： 小宮 啓義 ◎ 発行： SEMIジャパン ◎ 体裁： 四六版・227頁 ◎ 価格： 2,500円（税別） ◎ 販売方法：WEBサイト「SEMIジャパン ON DEMAND LIBRARY」(www.bookpark.ne.jp/semi/) ◎ 目次： まえがき ＜小宮啓義＞ 発刊にあたって ＜内田傳之助＞ 第1章 300mm標準化の流れ ＜小宮啓義＞ 1.1 第1回シリコンウェーハサミット 1.2 第2〜5回シリコンウェーハサミット 1.3 日本における300mm標準化の流れと国際協力 第2章 5団体連絡会､J300､J300Eの活動 2.1 はじめに ＜小池淳義＞ 2.2 5団体連絡会、J300の活動 ＜井入正博/徳永謙二＞ 2.3 WG内での議論 ＜児玉祥一＞ 2.4 J300からJ300Eへ ＜本間三智夫＞ 2.5 活動まとめ ＜小池淳義＞ 第3章 JEIDA､JEITAの活動 3.1 はじめに ＜垂井康夫＞ 3.2 1993年SEMI/JEIDAジョイントテクニカルシンポジウム ＜垂井康夫＞ 3.3 5団体連絡会の設立とJEIDAの対応 ＜垂井康夫＞ 3.4 ウェーハ外形規格の制定と提案 ＜松下嘉明＞ 3.5 ウェーハ端面形状などについての検討と提案 ＜清水博文＞ 3.6 ナノトポグラフィー ＜福田哲生＞ 3.7 まとめ ＜垂井康夫＞ 第4章 SEAJの活動 ＜林 義宣＞ 4.1 はじめに 4.2 SEAJにおける標準化活動 4.3 SEAJ 各WGの標準化活動 4.4 300mmウェーハカセット(キャリア）の標準化 4.5 まとめ 第5章 SEMATECH､I300I、ISMTの活動 ＜P. Gargini/F. Robertson＞ 5.1 はじめに 5.2 初期の300mm移行プログラム 5.3 SEMATECHの300mm移行プログラム 5.4 I300Iのスタンダード活動 5.5 グローバル組織との交流 5.6 自動化の焦点 5.7 300mmスタンダードの遺産 第6章 SEMIの活動 6.1 はじめに ＜本間三智夫＞ 6.2 他団体とSEMIとの協調 ＜谷 奈穂子＞ 6.3 SEMIでのグローバルスタンダード活動 ＜Murray Bullis＞ 6.4 300mm ウェーハ標準化の歴史 ＜山道正明＞ 6.5 ハードウェア・スタンダード ＜浅川輝雄＞ 6.6 ソフトウェア・スタンダード ＜坂本見恒＞ 6.7 搬送関連ソフトウェア ＜迎 健一＞ 6.8 300mm装置用安全仕様 ＜井深成仁＞ 6.9 300mm標準化活動の有効性検討 ＜開 俊一＞ 6.10 まとめ ＜本間三智夫＞ 第7章 Seleteの活動 7.1 はじめに ＜川島憲一＞ 7.2 Seleteの標準化、共通化への取り組み ＜川島憲一＞ 7.3 ファブインフラ早期確立への取り組み ＜徳永謙二＞ 7.4 FA/CIM 共通基盤技術の開発 ＜小林秀/増井知之＞ 7.5 ウェーハおよび安全仕様 ＜宮武久和＞ 7.6 まとめ ＜川島憲一＞ あとがき ＜小宮啓義＞ 付録 A.1 関係団体リスト A.2 用語集 A.3 関連スタンダードリスト ■SEMIスタンダード活動： SEMIスタンダードは、世界中の技術者に広く利用されている半導体ならびにフラットパネルディスプレイの製造装置・材料の国際 標準で、現在600を超える国際標準があります。SEMIスタンダードの策定には、世界各地のデバイス、製造装置、材料のメーカー 等の関係者が参加する「SEMIスタンダード委員会」があたっています。 ----------------------------------------------------------------------------------------------- SEMI（Semiconductor Equipment and Materials International） SEMIは、半導体およびフラットパネルディスプレイ（FPD）関連製造装置・材料産業の国際的な工業会組織として、業界の 健全な発展と国際協調を願って多岐にわたる活動を行っています。 現在、オースティン、サンノゼ、上海、シンガポール、新竹、ソウル、東京、ブリュッセル、北京、ボストン、モスクワ、ワシントン DCにオフィスがあり、会員企業は約2,500社、この内日本企業は約580社にのぼります。 ・SEMI本部： 3081 Zanker Road, San Jose, CA 95134-2127, U.S.A. Tel:+1-408-943-6900, Fax:+1-408-428-9600, E-mail:semihq@semi.org, URL:www.semi.org ・SEMI日本事務所：SEMIジャパン 代表 内田 傳之助 〒102-0074 東京都千代田区九段南4-7-15 健和ビル7F Tel:03-3222-5755, Fax:03-3222-5757, E-mail:semijapan@semi.org, URL:www.semi.org/japan |
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SEMICON West 2003 Opens July 14 with Technology Innovation Showcase Sixteen start-up companies will show novel solutions for IC manufacturing |
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| San Francisco, Calif., June 9, -- The next breakthrough in semiconductor manufacturing may be among the technologies presented by 16 start-up companies featured in a special one-day Technology Innovation Showcase at SEMICON West 2003. The display and presentation forum is designed to highlight for OEMs, IDMs and the financial community those technologies that demonstrate exceptional promise in meeting the challenges of next generation semiconductor manufacturing. “Creativity, innovation and entrepreneurship are thriving regardless of the current state of the industry economic cycle,” said Stanley T. Myers, president and CEO of SEMI, organizer of the event. “The TIS will shine a light on new and lesser-known companies developing novel applications to support the semiconductor manufacturing process.” The showcase will be held one day only, Monday July 14 in Room 120, Moscone Center, San Francisco. A series of half hour presentations on each technology will be given, with the first starting at 10.00 a.m. Representatives from each organization will be available throughout the day for further discussion. A separate exhibit area has been set aside so that the participating companies can showcase their products and solutions. “The rigorous selection process, involving 100 experts, identified 16 cutting edge products and processes from more than 70 applicants,” said Warren Moore, chairman of the TIS planning committee. The finalists include companies from Asia, Europe and the U.S. To qualify for inclusion in the showcase, the product or process had to be in the advanced development stage, but not yet in commercial production. Technology areas covered include e-manufacturing, cleaning, new materials and metrology. Specific solutions presented will range from mobile wireless wafer fab management applications to atomic scale surface cleaning of wafers. Many of the companies participating in TIS were established by engineers working in industries other than semiconductors, including aerospace and optoelectronics. With this insight and application experience from other sectors, the participants bring a new perspective to problems faced by semiconductor manufacturers. “These are the companies that didn’t know it couldn’t be done,” said Terry Francis, a member of the TIS selection committee. “The entrepreneurs behind these innovations don’t have our biases, our prejudices. They look at things in a new way,” Admission to the Technology Innovation Showcase is complimentary for registered SEMICON West 2003 visitors and exhibitors. Based in San Jose, Calif., SEMI is an international industry association serving more than 2,500 companies participating in the semiconductor and flat panel display equipment and materials markets. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit SEMI on the Internet at www.semi.org. |
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| # # # (Editor's Note: Following is a list of participating companies and the presentation schedule for the Technology Innovation Showcase). Technology Innovation Showcase - Schedule and Participants Monday, July 14, 10:00 a.m.- 6:00 p.m. Room 120, Moscone Center, San Francisco Presentation Schedule |
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| 10:00am - 10:30am Cyberfab Bluefab mobile wireless e-manufacturing PDA communication platform for fabs 10:30am - 11:00am Ahsoon Technologies, Inc. Intelliprom TM /APC process control software 11:00am - 11:30am Speedworks Software Automated image analysis 11:30am - 12:00pm Technic, Inc. Cerberus insitu sensor for process control of copper metalization 12:00pm - 12:30pm SemEquip, Inc. Cluster beam ion source 12:30pm - 1:00pm Micro Encoder, Inc. Absolute, 2-dimensional/rotational, sub-nanometer position sensor 1:00pm - 1:30pm Vertical Solutions Universal Load Port Buffer (ULPB) 1:30pm - 2:00pm Actinix PMT-193/PMT-157, photomask metrology tools 2:00pm - 2:30pm Imago Scientific Instruments LEAP 3-D Atom Probe Microscope, 3D analytical technique structure and composition 2:30pm - 3:00pm Renishaw plc Structure and chemical analyzer for SEM 3:00pm - 3:30pm Technos Co. Ltd. Pore size distribution measurement in low k dielectrics 3:30pm - 4:00pm MultiMetrixs RST, sensor thin film measurement technique 4:00pm - 4:30pm Quad Associated Products Franhaufer LA wave instrument for thin film properties 4:30pm - 5:00pm MetaStable Instruments Laser cleaning via attenuated total internal reflection 5:00pm - 5:30pm Phasor Scientific, Inc. Microcluster precision cleaning method 5:30pm - 6:00pm Paul Castrucci & Associates Super critical yield enhancement tool |
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complimentary. For additional information, please call 408.943.6981 |
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SEMI Publishes 13 New Standards Related to Semiconductor, FPD Manufacturing Common Specifications Contribute to Lower Costs, Faster Time to Market |
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| San Jose, Calif., June 2, 2003 ‐ SEMI today announced the publication
of 13 new technical standards relating to important aspects of semiconductor and flat panel display manufacturing. The new standards, developed by industry experts from equipment suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website, www.semi.org. SEMI Standards are published three times a year. The 13 new standards, part of the July 2003 (0703) publication cycle, join more than 620 standards that have been published by SEMI during the past 30 years. Included in the new standards are best practices for welding of fluid distribution systems in wafer fabs, provisional specifications for XML message structures, guidelines for calculating overall factory efficiency (OFE) and measurement methods for optical characteristics of flat panel display backlight units. “Standards are critical for reducing costs, speeding time to market and spurring development of new markets and technologies,” said Bruce Gehman, vice president, standards and chief technology officer, SEMI. “We are pleased to be able to introduce these 13 new specifications that will provide further cost savings and economies of scale for the semiconductor and flat panel display manufacturing industries.” The standards released today include: ・ SEMI D33-0703 ‐ Measuring Method of Optical Characteristics for Backlight Unit ・ SEMI D34-0703 ‐ Test Method for Measurement of FPD Polarizing Films ・ SEMI E122.1-0703 ‐ Specification for SECS-II Protocol for Tester Specific Equipment Model (TSEM) ・ SEMI E123.1-0703 ‐ Specification for SECS-II Protocol for Handler Specific Equipment Model (HSEM) ・ SEMI E124-0703 ‐ Provisional Guideline for Definition and Calculation of Overall Factory Efficiency (OFE) and Other Associated Factory-Level Productivity Metrics ・ SEMI E125-0703 ‐ Provisional Specification for Equipment Self Description (ESD) ・ SEMI E126-0703 ‐ Provisional Specification for Equipment Quality Information Parameters (EQIP) ・ SEMI E127-0703 ‐ Specification for Integrated Measurement Module Communications: Concepts, Behavior, and Services (IMMC) Table of Contents ・ SEMI E128-0703 ‐ Provisional Specification for XML Message Structures ・ SEMI F77-0703 ‐ Test Method for Electrochemical Critical Pitting Temperature Testing of Alloy Surfaces Used in Corrosive Gas Systems ・ SEMI F78-0703 ‐ Practice for Gas Tungsten Arc (GTA) Welding of Fluid Distribution Systems in Semiconductor Manufacturing Applications ・ SEMI F79-0703 ‐ Guideline for Gas Compatibility with Silicon Used in Gas Distribution Components ・ SEMI M23.6-0703 ‐ Specification for Round 150 mm Polished Monocrystalline Indium Phosphide Wafers (notched) About SEMI Standards: The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays and micro-electromechanical systems (MEMS). Approximately 2,900 volunteers worldwide participate in the program, which is made up of 17 global technical committees. Visit www.semi.org/standards for further details about SEMI Standards. About SEMI: Based in San Jose, Calif., SEMI is an international industry association serving more than 2,500 companies participating in the semiconductor and flat panel display equipment and materials markets. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org |
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| (Editor's Note: Following is more detailed information on a select number
of the new standards published today by SEMI). SEMI F78-0703 Practice for Gas Tungsten Arc (GTA) Welding of Fluid Distribution Systems in Semiconductor Manufacturing Applications The F78-0703 practice for gas tungsten arc (GTA) welding of fluid distribution systems is intended to provide a single source for a welding standard applicable to the precise and contamination-free welds necessary for semiconductor manufacturing applications. GTA automatic welding is widely used as a construction method for semiconductor manufacturing equipment, fluid distribution system components, and in wafer fabs. Due to the lack of a uniform standard, many end users had developed internal specifications for this process. “SEMI F78-0703 provides a proven procedure for GTA automatic welds that will meet the purity standards of the industry,” said Sunniva R. Collins, research metallurgist at Swagelok. “This standardization should eliminate confusion, misunderstanding, and quality inspection discrepancies,” added Ed Wolf, Swagelok training specialist. SEMI E124-0703 Provisional Guideline for Definition and Calculation of Overall Factory Efficiency (OFE) and Other Associated Factory-Level Productivity Metrics This standard relates to the efficiency of the entire factory and offers a method of conceptualizing and measuring the efficiency of a complex manufacturing process. In addition to measuring overall factory efficiency, the standard also defines several other key industry metrics such as throughput, cycle time and work-in-progress. SEMI E125-0703 Provisional Specification for Equipment Self Description (ESD) The E125-0703 standard makes it possible to discover what data, events, exceptions, and objects are available for data acquisition from each component of the equipment, thus providing more up to date software to engineers and significantly reducing the level of paper documentation from suppliers. “The specification can help realize cost savings by enabling improved efficiency in the process of integrating equipment data into engineering and other manufacturing applications,” said James W. Martin, system software engineer, Intel Corp. The specification is the second (following E120, the Common Equipment Model) in a suite of four standards from SEMI focused on improving the total data throughput from the equipment independently of the GEM interface. The development of this specification is a key enabler to achieving future fault detection and classification (FDC), run-to-run control, e-diagnostics, and Overall Equipment Efficiency (OEE) goals in manufacturing. SEMI E127-0703 Specification for Integrated Measurement Module Communications E127-0703 provides a standard interface for integrated measurement used in the inspection and metrology process. Integrated measurement eliminates the time and expense of taking wafers to a stand-alone tool for measurements. “Having a standard interface will lower the cost and shorten the time required to add a measurement module provided by a third party supplier to a tool,” said Margaret Pratt, a consultant with Margaret Pratt Consultants. Without this new standard tool suppliers were forced to write new programming code in order to introduce a new measurement process into a tool. As such, E127 will greatly reduce both cost and time involved in integration. SEMI E128-0703 Provisional Specification for XML Message Structures E128-0703 is intended to achieve interoperability between semiconductor manufacturing software. Standard XML message structures will enable software developed by independent suppliers to be exchanged using commercial tools for message creation and parsing. “The XML messaging standard provides the basis for open communication in next generation software applications much the way SECS-II has supported the current software implementations, ” said Bob Hodges, senior staff member -- technical, at Texas Instruments Inc. The XML message structures specified in this standard will reduce cost to suppliers through the use of software technologies being applied in many industries. It will allow semiconductor manufacturing suppliers and users to leverage tools and experience from a broad base rather than defining a parochial standard used only in the semiconductor industry. SEMI D33-0703 Measuring Method of Optical Characteristics for Backlight Unit The new standard relating to FPD backlight units provides a unified means of testing optical characteristics of the backlight unit used in LCDs. Prior to the introduction of this standard, each company employed its own method of testing for factors such as measurement distance and position, the number of measuring points, luminance stable time and uniformity formula. Applying this standard will help reduce the cost and time taken for the inspection process. “This standard will allow the backlight unit manufacturer and the panel maker achieve cost savings and economic benefits,” said Lee Don Gyou, associate research engineer, LG.Philips LCD. SEMI D34-0703 Test Method for Measurement of FPD Polarizing Films The second FPD-related standard covers test methods for measurement of polarizing films used in TFT LCD manufacturing. It establishes implementation guidelines for the measurement of visual appearance, thickness and optical characteristics of polarizing films. Adoption of this standard will contribute to cost savings by reducing the number of size variations of polarizing film by implementing a common measurement method. “The methods described in this standard can be applied in manufacturing, quality control and research and development,” said Iwasaki Takehiko, Chief Engineer, Manufacturing Section 3, Optical Related Product Sector, Nitto Denko Corp. SEMI E126-0703 Provisional Specification for Equipment Quality Information Parameters (EQIP) As the industry moves to smaller geometries and larger wafers, Run-to-Run (R2R) control (also known as Advanced Process Control) is becoming a required component to achieve acceptable yield and throughput. R2R control is a form of discrete process control in which the process is adjusted between “runs” so as to achieve process targets. A key impediment to its implementation has been the lack of a standard mechanism to allow the integration of automated R2R control into the equipment. “With this standard in place, users now have a way to guarantee that the equipment they purchase is enabled for R2R control,” said James Moyne, director of advanced process control technology at Brooks Automation. “This will allow for faster specification deployment of R2R control, which will lead to faster ramp-up times, and improved process capabilities.” |
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SEMICON West 2003 Set for July 14-18 in San Francisco and San Jose Premier Annual Semiconductor Event Adds MEMS Exhibit and New Technical Programs |
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| SAN JOSE, Calif., May 20, 2003 -- The 2003 edition of SEMICON West, the gateway to the global supply chain for semiconductor and related microelectronics manufacturing, is set to open July 14 in San Francisco, continuing July 16 in San Jose. The expo is the world’s largest devoted to manufacturing technologies for semiconductors, flat panel displays, MEMS and related microelectronics industries. This year it will include several new exhibits and programs designed to broaden the exposition experience for visitors and facilitate increased information exchange between suppliers and users. The 33rd annual SEMICON West opens at the Moscone Center with the Wafer Processing segment July 14-16, and continues at the San Jose Convention Center with the Final Manufacturing segment, July 16-18. SEMICON West 2003 is presented by Semiconductor Equipment and Materials International (SEMI). This year’s exposition will feature more than 1,400 exhibiting companies from around the world occupying more than 334,307 net square feet of exhibit space, showcasing the latest developments in semiconductor and related equipment, materials, services and technology. Last year, more than 60,000 people registered for the week-long show, making it one of the largest trade expositions in Silicon Valley. “SEMICON West affords a unique opportunity for access to industry experts on all aspects of chip making,” said Vicki Hadfield, president of SEMI North America. “As the venue for the world’s most comprehensive array of semiconductor manufacturing tools and processes, SEMICON West serves as the gateway to the global supply chain.” This year’s exposition features a number of new events designed to facilitate increased interaction and deliver critical trend information that will define the future semiconductor and related technologies landscape. Some of the new programs include: Technology Innovation Showcase, Monday July 14, at Moscone Center; where representatives from 20 innovative companies will present products and concepts for the future. MEMS Pavilion, Monday July 14 to Wednesday July 16, Esplanade Hall, Moscone Center; a showcase of the latest technologies and tools dedicated to MEMS. This event is co-sponsored by the MEMS Industry Group and MANCEF, the Micro and Nanotechnology Commercialization Education Foundation. Lithography programs, held July 14 and July 15, covering key business and technical issues for engineers, technology managers and technicians. These events are co-sponsored by SPIE, the International Society for Optical Engineering. Fab Managers Forum, Thursday, July 17, held at National Semiconductor Corp. in Sunnyvale, Calif. where managers from the wafer fab and supplier community will gather to discuss ways to increase overall productivity. For more information about SEMICON West 2003, including exhibits-only and paid program registration, visit the SEMICON West 2003 website at www.semi.org/semiconwest, or call SEMI Customer Service at 1.408.943.6901. Qualified journalists wishing to attend SEMICON West 2003 must pre-register for media accreditation. Contact Jennifer Blatt, SEMI Public Relations at 1.408.943.7988 (jblatt@semi.org). Based in San Jose, Calif., SEMI is an international industry association serving more than 2,500 companies participating in the semiconductor and flat panel display equipment and materials markets. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit SEMI on the Internet at www.semi.org |
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(Editor's Note: The following a schedule of media events and programs presented at SEMICON West.) EXPOSITION HOURS WAFER PROCESSING -- SAN FRANCISCO MOSCONE CENTER Monday, July 14 10:00 a.m.-6:00 p.m. Tuesday, July 15 10:00 a.m.-6:00 p.m. Wednesday, July 16 10:00 a.m.-4:00 p.m. TEST, ASSEMBLY AND PACKAGING -- SAN JOSE CONVENTION CENTER Wednesday, July 16 10:00 a.m.-6:00 p.m. Thursday, July 17 10:00 a.m.-6:00 p.m. Friday, July 18 10:00 a.m.-4:00 p.m. PRESS ROOM HOURS/LOCATIONS SAN FRANCISCO: Moscone Center, Room 300, South Hall, Esplanade Level Sunday, July 13 1:00 p.m.-4:00 p.m. Monday, July 14 9:00 a.m.-6:00 p.m. Tuesday, July 15 9:00 a.m.-6:00 p.m. Wednesday, July 16 9:00 a.m.-4:00 p.m. SAN JOSE: San Jose Convention Center, Room K, McEnery Hall, Street Level Tuesday, July 15 1:00 p.m.-4:00 p.m. Wednesday, July 16 9:00 a.m.-6:00 p.m. Thursday, July 17 9:00 a.m.-6:00 p.m. Friday, July 18 9:00 a.m.-4:00 p.m. SEMICON WEST 2003 PRESS CONFERENCES WAFER PROCESSING -- SAN FRANCISCO MOSCONE CENTER Moscone Center, Room 113 (Lower North, Hall Lobby) (Signed as "SEMI Press Conference Room") Monday, July 14 10:30 - 12:00 SEMI - SEMICON West Press Conference TEST, ASSEMBLY AND PACKAGING -- SAN JOSE CONVENTION CENTER San Jose Convention Center, Room L (Street Level) (Signed as "SEMI Press Conference Room") Wednesday, July 16 10:30 - 12:00 SEMI - SEMICON West Press Conference 14:00 - 14:45 Advantest SEMI Technical Symposium Location: San Francisco Marriott Hotel Monday, July 14 9:00 am - 12:00 pm ISM Session 101: EHS Part 1 Addressing Emerging EHS Challenges 9:00 am - 12:00 pm ISM Session 102: CFM Part 1 Contamination Reduction Methodologies and Advances in Fluid Delivery 2:00 pm - 5:00 pm ISM Session 103: EHS Part 2 Implementation of Current EHS Solutions 2:00 pm - 5:00 pm ISM Session 104: CFM Part 2 Advanced Wafer Cleaning and Surface Preparation Tuesday, July 15 9:00 am - 12:00 pm ISM Session 105: Integrating Process and Equipment Control in the 300 mm Factory 9:00 am - 12:00 pm ISM Session 106: Advances in Trace Gas Analysis 9:00 am - 12:00 pm ISM Session 107: Future Device Technologies 2:00 pm - 5:00 pm ISM Session 108: Material Handling in the Fully Automated 300 mm Facility 2:00 pm - 5:00 pm ISM Session 109: Analytical Techniques for In Situ Process Monitoring 2:00 pm - 5:00 pm ISM Session 110: Advanced Processing For MEMS, MRAM and Semiconductor Wednesday, July 16 9:00 am - 12:00 pm ISM Session 111: Chemical Mechanical Planarization Technology 9:00 am - 12:00 pm ISM Session 112: Infrastructure for Advanced Lithography 9:00 am - 12:00 pm ISM Session 113: Current Interconnect Process Control and Challenges Equipment and Materials Market Briefing Location: Moscone Tuesday, July 15 8:30 am - 12:00 pm Equipment and Materials Market Briefing SEMI Technical Symposium Location: San Jose Marriott Hotel Wednesday, July 16 &nb |